21 - 40 of about 43

• 21.

  Biaxial stress measurement using the grain growth direction in electrodeposited copper foil , Cheng Li,Yuichi Ono,Daisuke Hino , Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A , vol.76 (765) (p.581 - 586) , 2010 , There is Review , The Multiple Authorship , Japanese

• 22.

  Propagation Behavior of a Surface Crack Occurred at the Plate under Combined Stress State of Cyclic Bending and Static Torsion , ONO Yuichi,LI Cheng,BOKURA Masashi , TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A , vol.76 (768) (p.1076 - 1081) , 2010 , There is Review , The Multiple Authorship , Japanese

• 23.

  Grain Growth Behavior in Electrodeposited Copper Foil Under Nonproportional Loading , Yuichi ono, Cheng Li, Daisuke Hino , Journal of Materials and Metallurgy , vol.9 (3) (p.222 - 228) , 2010 , There is Review , The Multiple Authorship , English

• 24.

  Cyclic Compressive Load Measurement Using Electrodeposited Copper Foil , Yuichi Ono, Cheng Li, Toru Maruhisa , Journal of JSEM , vol.10 (Special Issue) (p.135 - 140) , 2010 , There is Review , The Multiple Authorship , English

• 25.

  Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Electrodeposited Copper Foil , Yuichi Ono, Cheng Li, Daisuke Hino , EURASIP Journal on Advances in Signal Processing , vol.2010 (ID 928216) (p.0) , 2010 , There is Review , The Multiple Authorship , English

• 26.

  Grain Growth Behavior in Electrodeposited CopperFoil Under Out-of-phase Cyclic Loading , Yuichi Ono, Cheng Li, Daisuke Hino , Proc. of 5th ISEM-2010 , vol.79 (0) (p.0) , 2010 , The Multiple Authorship , English

• 27.

  Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Copper Foil , Yuichi Ono, Cheng Li, Daisuke Hino , Proc. of 4th ISEM-2009 , vol.MA-Ⅲ-1 (0) (p.38 - 0) , 2009 , The Multiple Authorship , English

• 28.

  Biaxial stress measurement using electrodeposited copper foil (Method to judge the sign of biaxial stress ratio using grain growth direction) , Yuichi Ono,Cheng Li , Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A , vol.75 (759) (p.1624 - 1629) , 2009 , There is Review , The Multiple Authorship , Japanese

• 29.

  Cyclic Stress Measurement Method Using Electrodeposited Copper Foil (Static Stress Effect on Grain Nucleation and Grain Growth) , Yuichi Ono, Cheng Li , Journal of JSEM , vol.19 (Special Issue) (p.112 - 117) , 2009 , There is Review , The Multiple Authorship , English

• 30.

  Cyclic Pressure Measurement Method Using Electrodeposited Copper Foil , Yuichi Ono, Cheng Li, Toru Maruhisa , Proc. of 4th ISEM-2009 , vol.MA-Ⅴ-1 (0) (p.64 - 0) , 2009 , The Multiple Authorship , English

• 31.

  Application of Copper Electroplating Method to an Element that Changes the Principal Axes of Strain : Superposing Static Torsion on Rotating Bending , ONO Yuichi,LI Cheng,KITAOKA Seiichiro , TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A , vol.74 (748) (p.1550 - 1556) , 2008 , There is Review , The Multiple Authorship , Japanese

• 32.

  Application of Copper Electroplating Method to an Element that Changes the Principal Axis of Strain , Y.Ono,C. Li , Proc. 3rd international symposium on advanced fluid/solid science and technology in experimental mechanics , vol.0 (0) (p.16 - 0) , 2008 , There is No Review , The Multiple Authorship , English

• 33.

  Cyclic Pressure Measurement Method Using Grown Grains Occurred in the Electrodeposited Copper Foil : Improvement of Pressure Sensitivity by Controlling the Real Contact Area , vol.8 (4) (p.416 - 421) , 2008 , There is Review , The Multiple Authorship , Japanese

• 34.

  Measurement of High Contact Pressure Using Nickel-Phosphorus Alloy Foil with Conical Projections , ONO Yuichi,KITAOKA Seiichiro,MATSUSHIMA Takeshi , TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A , vol.74 (747) (p.1447 - 1452) , 2008 , There is Review , The Multiple Authorship , Japanese

• 35.

  An Application of Electrodeposited Copper Foil with Micro Projections to the Measurement of Pressure between Two Rollers in Contact , Y.Ono,S.Kitaoka,T.Hasegawa,T.Matsushima , Transactions of the Japan Society of Mechanical Engineers(A) , vol.73 (726) (p.238 - 243) , 2007 , There is Review , The Multiple Authorship , Japanese

• 36.

  The cyclic stress measurement method using grain size and occurrence rate of grown grains in electrodeposited copper foil , Y.Ono,S.Kitaoka　 , Proc. 2nd international symposium on advanced fluid/solid science and technology in experimental mechanics , vol.0 (0) (p.17 - 0) , 2007 , There is No Review , The Multiple Authorship , English

• 37.

  Biaxial Stress Measurement by Electrodeposited Copper Foil with Circular Holes , S. Kitaoka, Y. Ono , Strain , vol.42 (0) (p.49 - 56) , 2006 , There is Review , The Multiple Authorship , English

• 38.

  Measurement of Biaxial Stress Using Shape of Grown Grains around Circular Holes in Electrodeposited Copper Foil(Minimization of Hole Diameter and Effect of Modulus of Elasticity of the Material) , Y.Ono,S.Kitaoka,K.Muramatsu,Y.Hashimoto , Transactions of the Japan Society of Mechanical Engineers(A) , vol.72 (720) (p.1145 - 1152) , 2006 , There is Review , The Multiple Authorship , Japanese

• 39.

  Measurement of Mean Stress Using Nickel Alloy Foil with Microcircular Holes(Improvement of Accuracy and Influence of Frequency) , Y.Ono,S.Kitaoka,Y.Ikegami,Y.Tanaka,M.Toriyama , Transactions of the Japan Society of Mechanical Engineers(A) , vol.71 (704) (p.636 - 641) , 2005 , There is Review , The Multiple Authorship , Japanese

• 40.

  Measurement of Biaxial Stress Using Grown Grain Distributed Shape in Electrodeposited Copper Foil with Circular Holes , vol.70 (693) (p.771 - 776) , 2004 , There is Review , The Multiple Authorship , Japanese

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